Q-switch laser can cut wafers with thickness 25 µm -300 µm, while the long pulse laser is used for wafers with thickness up to 1-2 mm. Table 1 shows typical parameters for Q …
Read OnQ-switch laser can cut wafers with thickness 25 µm -300 µm, while the long pulse laser is used for wafers with thickness up to 1-2 mm. Table 1 shows typical parameters for Q …
Read OnSynova SA, Chemin de la Dent d'Oche, 1024 Ecublens, Switzerland Abstract The Laser MicroJet® technology uses a water coupled ns-laser to cut various materials e.g. diamond, semiconductors, ceramics and metals. The laser light is guided to the workpiece by the water jet and the material is cut by the laser radiation.
Read On5-axis laser machining The Synova LCS 50-5 laser cutting system (working area: 50 x 50 x 50 mm) can cut extremely hard materials with highest precision. It is a compact machine with 5-axis capability with a user-friendly …
Read OnThe LCS 300 is Synova's workhorse and most sold machine. This laser cutting system has a working area of 300 x 300 mm and enables high-precision machining of almost all metals, super-hard materials and ceramic for the watch, medical and …
Read OnLMJ machines provide cutting, drilling, edge grinding and dicing solutions for a broad range of precision machining applications, such as: Energy and Aviation: Allowing for the processing of superalloys with or without thermal barrier coating (TBC) as well as Ceramic Matrix Composites (CMC) in one simple step, without cracks or delamination and ...
Read OnSynova Confidential Products Laser Dicing System (LDS) Laser Edge-Grinding System (LGS) with DIT Hybrid Laser Saw (HLS) with Disco Loading system Dicing / trimming / scribing of wafers Laser Cutting System (LCS) General purpose Diamond Cutting System (DCS) Laser Drilling System with Posalux Cutting of diamonds Machines with Manufacturing Partners
Read Onmilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), engraving, profiling The LCS 305 with integrated water jet guided laser technology (Laser MicroJet®) is specifically designed for the automatic production of large and small diamond cutting tools. The CNC machine with five synchronous axes is
Read OnSynova's LMJ process achieves an edge waviness of less than one micron with 0.5 PCD grains. The Synova LCS 50-5 laser machining process delivers an extremely fine surface finish (Ra ≤ 0,3 micron) for PCD tools, which eliminates the need for a second grinding operation.
Read OnDomaine d'activité: Inventeur de la technologie laser guidé au jet d'eau ? Laser MicroJet®, Synova fournit des systèmes de découpe haute précision, pour une large gamme d?applications de micro usinage dans les domaines horlogerie, médical, diamant naturel, semi-conducteurs, photovoltaïque, électronique, automobile et machine-outil.
Read OnInnovative Laser Machining Systems Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-the-art cutting and dicing solutions as well as drilling and edge grinding systems for the energy, aerospace, tool, diamond, semiconductor, watchmaking, elec-tronic, automotive and medical industries.
Read OnSynova's LMJ process achieves an edge waviness of less than one micron with 0.5 PCD grains. The Synova LCS 50-5 laser machining process delivers an extremely fine surface finish (Ra ≤ 0,3 micron) for PCD tools, …
Read OnLaser machines for cutting edge processing - Indiamond Laser machines for cutting edge processing ( ) Alphabet A-Z Alphabet Z-A Date (newest first) Date (oldest first)
Read OnVolume Production of Machining Tools using Laser MicroJet® technology Volume production of high precision tools with New 5-axis Laser Machining System LCS 305-5 Rémi Laure, Amédée Zryd, Jacques Coderre Introduction Industrial diamond materials are replacing tungsten carbide and ceramic composites in cutting tools where high surface finish quality is required.
Read On3-axis machine: 2D cutting, drilling, slicing, grooving 5-axis machine: 3D shaping, cutting, drilling, slicing, edge grinding (K-land edges, single or multiple clearance angles), grooving, milling, engraving The LCS 50 is Synova's most compact and cost-efficient Laser MicroJet® (LMJ) machine. The LCS 50 is
Read Onedge grinding, grooving, scribing, milling, dicing, shaping in 3 and 5 axes, trenching, profiling and engraving. Shapes LMJ machines allow omni-directional ablation pro-cesses, making the creation of any shape possible. This provides customers with the flexibility to develop new ideas and applications, from making small wheels for the
Read OnSynova SA, Switzerland Precision cutting and grooving with the Laser MicroJet ... EPMT 2010 3 Founded: 1997 Headcount: 60 employees Company. EPMT 2010 4 Products Laser Dicing System (LDS) Laser Grinding System (LGS) Hybrid Laser Saw (HLS) w/ Disco Corp. Cutting / grooving of wafers Laser Stencil System (LSS) ... SYSTEM Machine type LCS300 ...
Read OnAdvanced CNC laser cutting systems with micron precision . Synova is the pioneer of a revolutionary water jet guided laser technology (Laser MicroJet ®) providing state-of-the-art cutting and drilling solutions as well as dicing and edge-grinding systems for the energy, aerospace, tool, diamond, semiconductor, watchmaking, electronic, automotive and medical …
Read OnFirst Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland. 2001 : Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS) 1997 : Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. 1993
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